Method for dicing composite wafers

Details Method for dicing composite wafers Method for dicing composite wafers

1993-06-01

1994-11-29

Fourson, George

Fishing, trapping, and vermin destroying

148DIG28, 156645, 83 51, 125 1301, H01L 21302

Patent

active

053690605

ABSTRACT:
In a method for dicing multi-layer composite wafers, proceeding from an upper side of the wafer, cuts are introduced into an upper layer of the wafer and, proceeding from a lower side of the wafer, cuts are introduced into a lower layer of the wafer.

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Micro-Swiss, 1991, Gideon Levinson, "Principles of Dicing".
IEEE Transactions on Semiconductor Manufacturing, vol. 4, No. 1, Feb. 1991, Chang et al., "Hybrid Wafer-Dicing Process for GaAs MMIC Production".

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