Method for dicing a semiconductor wafer

Details Method for dicing a semiconductor wafer Method for dicing a semiconductor wafer

1992-03-04

1994-05-24

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

148DIG28, H01L 21302, H01L 21304

Patent

active

053148444

ABSTRACT:
A method of dicing a wafer of III-V compound material without causing chipping and cracks. The method includes the steps of forming a scribe line on a surface of the wafer orthogonal to a crystal plane (011) by means of a scribing method, forming a groove in the semiconductor wafer in parallel to the crystal plane (011) by means of a grinding-cutting method, and breaking the semiconductor wafer along the scribe line and the groove.

REFERENCES:
patent: 5182233 (1993-01-01), Inoue

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