Method for diagnosing the life of a solder connection

Details Method for diagnosing the life of a solder connection Method for diagnosing the life of a solder connection

1992-01-06

1994-03-01

Black, Thomas G.

Boots, shoes, and leggings

364578, 364552, 73799, G01M 500

Patent

active

052914194

ABSTRACT:
A method for evaluating the life of a connection between members including the steps of extracting parameters defining the shearing strain of a predetermined model representing the connection thereby to calculate the values of plural shearing strains of the connection, calculating the equivalent strain amplitude corresponding to thermal fatigue stress for each of the values of the plural shearing strains defining the relationship between the shearing strain and the equivalent strain amplitude, formulating a life evaluation criterion equation expressed using the equivalent strain amplitude, calculating, for the connection, the equivalent strain amplitude corresponding to each of the shearing strains actually measured using the equation, and substituting the equivalent strain amplitude for the life evaluation criterion equation to acquire the life of the connection. Further, in this method, an equation for evaluating the advancement of a crack is made using the equivalent strain amplitude, and the equivalent is substituted for the crack advancement evaluation equation to calculate the length of the crack.

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Lin et al., Design Considerations for a Flip-Chip Joining Technique, Solid State Technology, pp. 48-54, Jul. 1970.
"A Thermal Fatigue of Ph-Sn alloy minute connection in electronic circuit", extended abstracts of the 103rd Autumn Convention of NIPPON KINZOKU Gakkai, pp. 144-145, Nov. 1989.

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