Chemistry: electrical and wave energy – Processes and products
Patent
1979-10-25
1982-06-22
Kaplan, G. L.
Chemistry: electrical and wave energy
Processes and products
156627, 427 8, G01N 2706
Patent
active
043361110
ABSTRACT:
Disclosed is a method for determining the strength of a metal processing solution, defined herein to include electroless metal plating solutions and chemical etching solutions wherein a metal is plated onto and stripped from, respectively, the surface of a metal substrate. A pair of electrodes, preferably composed of the metal being plated in the case of an electroless metal plating solution or the metal having been etched in the case of a chemical etching solution, are immersed spaced from one another in the metal processing solution. A voltage is gradually applied across the electrodes and steadily increased. As the voltage is increased, the current flowing between the electrodes in the solution is monitored. The point at which the current first passes through a maximum value and begins to decrease is recorded as a function of time or voltage and is correlated empirically with the strength of the metal processing solution.
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Kaplan G. L.
The Boeing Company
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