Method for determining the location of a droplet on a component

Semiconductor device manufacturing: process – With measuring or testing

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

06838295

ABSTRACT:
Method for determining the location of a droplet of liquid placed on a surface of a semiconductor wafer. In one embodiment the method includes establishing first and second reference axes that intersect at a point and superimposing the point over the droplet on the semiconductor wafer surface. A first reference coordinate indicative of the position of the point along the first axis and a second reference coordinate indicative of the position of the point along the second axis are generated.

REFERENCES:
patent: 2424619 (1947-07-01), Keepers
patent: 5249216 (1993-09-01), Ohsugi et al.
patent: 5395446 (1995-03-01), Kageyama et al.
patent: 5686314 (1997-11-01), Miyazaki
patent: 5842825 (1998-12-01), Brooks
patent: 5882938 (1999-03-01), Takahashi et al.
patent: 5961722 (1999-10-01), Buhrer et al.
patent: 6060113 (2000-05-01), Banno et al.
patent: 6242271 (2001-06-01), Buhrer et al.
patent: 6544803 (2003-04-01), Buhrer et al.
C. Neumann and P. Eichinger, Ultra-Trace Analysis of Metallic Contaminations on Silicon Wafer Surfaces by Vapour Phase Decomposition/Total Reflection X-Ray Fluorescene (VPD/TXRF), Spectochimica Acta, vol. 46B, No. 10, 1991.
Diebold, Maillot, Gordon, Baylis, Chacon, Witowski, Arlinghaus Knapp and Doyle, Evaluation of Surface Analysis Methods for Characterization of Trace Metal Surface Contaminants Found in Silicon Integrated Circuit Manufacturing, J. Vac. Sci. Technology, A, vol. 10, No. 4, Jul./Aug. 1992.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for determining the location of a droplet on a component does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for determining the location of a droplet on a component, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for determining the location of a droplet on a component will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3412992

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.