Semiconductor device manufacturing: process – With measuring or testing
Reexamination Certificate
2005-01-04
2005-01-04
Kielin, Erik J. (Department: 2813)
Semiconductor device manufacturing: process
With measuring or testing
Reexamination Certificate
active
06838295
ABSTRACT:
Method for determining the location of a droplet of liquid placed on a surface of a semiconductor wafer. In one embodiment the method includes establishing first and second reference axes that intersect at a point and superimposing the point over the droplet on the semiconductor wafer surface. A first reference coordinate indicative of the position of the point along the first axis and a second reference coordinate indicative of the position of the point along the second axis are generated.
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Buhrer Gayle
Drussel Zane L.
Blum David S.
Kielin Erik J.
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