Method for determining silicon content in layers of aluminum and

Details Method for determining silicon content in layers of aluminum and Method for determining silicon content in layers of aluminum and

1980-05-29

1981-08-04

Powell, William A.

Coating processes

Measuring, testing, or indicating

Thickness or uniformity of thickness determined

156626, 156656, 156665, 252 793, 427 92, 427405, 427436, B05D 512, C23F 100

Patent

active

042822661

ABSTRACT:
The method provides an extremely fast and non-destructive method for determining whether an integrated circuit will have good bonding characteristics. The method entails immersion plating of copper onto aluminum areas. Then, the aluminum areas are observed visually to see if the copper plated thereon is continuous or discontinuous. If the copper is discontinuous, the aluminum film will have good bonding characteristics.

REFERENCES:
patent: 3669734 (1972-06-01), Jacob et al.
patent: 3672964 (1972-06-01), Bellis

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