Method for determining pattern misalignment over a substrate

Details Method for determining pattern misalignment over a substrate Method for determining pattern misalignment over a substrate

2007-01-09

2007-01-09

Young, Christopher G. (Department: 1756)

Radiation imagery chemistry: process, composition, or product th

Registration or layout process other than color proofing

C430S030000

Reexamination Certificate

active

11336492

ABSTRACT:
A two dimensional vernier is provided along with a method of fabrication. The two dimensional vernier has a reference array patterned into a substrate, or a material overlying the substrate. An active array is patterned into photoresist overlying the substrate or the material. Both the reference array and the active array each comprise a two dimensional array of shapes. A difference between a combination of size or spacing of the shapes in each array determines vernier resolution. Vernier range is determined by a combination of vernier resolution and an integer related to a total number of shapes along a given axis. The two dimensional vernier allows an operator to readily measure the misalignment of a pattern to be processed relative to a previous pattern in two dimensions using a microscope. The two dimensional vernier reduces, or eliminates, repositioning of the microscope to determine both x-axis misalignment and y-axis misalignment. If a significant misalignment is detected the photoresist can be stripped and the lithography step repeated prior to subsequent processing, and possible yield reduction.

REFERENCES:
patent: 5017514 (1991-05-01), Nishimoto
patent: 6465322 (2002-10-01), Ziger et al.

Affiliated with

Also associated with

Rating

Method for determining pattern misalignment over a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for determining pattern misalignment over a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for determining pattern misalignment over a substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3822660