Metal fusion bonding – Process – With measuring – testing – indicating – inspecting – or...
Reexamination Certificate
2005-08-16
2005-08-16
Edmondson, Lynne R. (Department: 1725)
Metal fusion bonding
Process
With measuring, testing, indicating, inspecting, or...
C228S102000, C228S180500
Reexamination Certificate
active
06929168
ABSTRACT:
A method for finding optimum bond parameters for a bond force FBand an ultrasonic variable P and, optionally, at least one further bond parameter of a wire bonder uses a sensor sensitive to a shear force exerted by the capillary on a connection point. A predetermined number of bonding operations with varying bonding parameters is performed. Optimum bond parameters are derived from the signal of the sensor.
REFERENCES:
patent: 3458921 (1969-08-01), Christensen
patent: 3523360 (1970-08-01), Moore
patent: 4479386 (1984-10-01), Beggs et al.
patent: 4586642 (1986-05-01), Dreibelbis et al.
patent: 4597519 (1986-07-01), Kurtz et al.
patent: 4815001 (1989-03-01), Uthe et al.
patent: 4854494 (1989-08-01), von Raben
patent: 4998664 (1991-03-01), Gibson et al.
patent: 5586713 (1996-12-01), Arita et al.
patent: 5832412 (1998-11-01), Guez
patent: 5884834 (1999-03-01), Vinson et al.
patent: 5884835 (1999-03-01), Kajiwara et al.
patent: 6279810 (2001-08-01), Chan-Wong et al.
patent: 6308881 (2001-10-01), Hesse et al.
patent: 6648205 (2003-11-01), Mayer et al.
patent: 6724128 (2004-04-01), Cheng et al.
patent: 2004/0079790 (2004-04-01), Mayer et al.
patent: 41 31 565 A 1 (1993-03-01), None
patent: 101 10 048 A 1 (2002-09-01), None
patent: 0 540 189 (1993-05-01), None
patent: 0 786 323 (1997-07-01), None
patent: 0 953 398 (1999-11-01), None
Mayer et al.; “Active Test Chips for In Situ Wire Bonding Process Characterisation”, Technical Programmes of SEMICON, Singapore May 7-11, 2001, pp. 17-26, SINGAPORE.
Schwizer et al.; “Thermosonic Ball Bonding: Friction Model Based on Integrated Microsensor Measurements”, IEEE Intl. Electronic Manufacturing Technology Symposium IEMT'99, Austin, Texas, Oct. 18-19, 1999, pp. 108-114, Texas, USA.
Mayer et al.: “In-Situ Ultrasonic Stress Measurements During Ball Bonding Using Integrated Piezoresistive Microsensors”, EEP-vol. 26-1, Advances in Electronic Packaging—1999, vol. 1, ASME 1999, pp. 973-978, USA.
Mayer Michael
Schwizer Jürg
Edmondson Lynne R.
ESEC Trading SA
McCormick Paulding & Huber LLP
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