Semiconductor device manufacturing: process – With measuring or testing – Optical characteristic sensed
Reexamination Certificate
2007-02-13
2011-11-29
Smith, Bradley K (Department: 2894)
Semiconductor device manufacturing: process
With measuring or testing
Optical characteristic sensed
C257SE21530
Reexamination Certificate
active
08067252
ABSTRACT:
According to one exemplary embodiment, a method for determining a power spectral density of an edge of at least one patterned feature situated over a semiconductor wafer includes measuring the edge of the at least one patterned feature at a number of points on the edge. The method further includes determining an autoregressive estimation of the edge of the at least one patterned feature using measured data corresponding to a number of points on the edge. The method further includes determining a power spectral density of the edge using autoregressive coefficients from the autoregressive estimation. The method further includes utilizing the power spectral density to characterize line edge roughness of the at least one patterned feature in a frequency domain.
REFERENCES:
patent: 2006/0095254 (2006-05-01), Walker et al.
Levinson Harry J.
Ma Yuansheng
Wallow Thomas
Advanced Micro Devices , Inc.
Farjami & Farjami LLP
Movva Amar
Smith Bradley K
LandOfFree
Method for determining low-noise power spectral density for... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for determining low-noise power spectral density for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for determining low-noise power spectral density for... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4290533