Thermal measuring and testing – Determination of inherent thermal property
Patent
1997-07-21
1999-12-07
Gutierrez, Diego
Thermal measuring and testing
Determination of inherent thermal property
374164, 374141, G01N 2520, G01K 700
Patent
active
059971746
ABSTRACT:
The junction temperature of a die inside an electronic component is empirically determined by use of a board simulator that simulates a target board on which the electronic component is to be operated. The board simulator's thermal resistivity is determined in a first calibration step by measuring the difference in temperatures between two thermocouples mounted on two sides of the board simulator. Then, the board simulator is attached to a test component that includes a heating element and a temperature sensor. In a second calibration step, for a known thermal power generated by the heating element, the junction temperature of the test component is measured for different values of thermal resistivity of the board simulator. Next in a measurement step, the user determines the thermal resistivity of the target board. Then the user uses the measured resistivity to look up the junction temperature of the test component from the calibration measurements, which is the estimated junction temperature of the electronic component.
REFERENCES:
patent: 3592060 (1971-07-01), Laverman
patent: 3733887 (1973-05-01), Stanley et al.
patent: 3926052 (1975-12-01), Bechtel
patent: 4498789 (1985-02-01), Kiss et al.
patent: 4614721 (1986-09-01), Goldberg
patent: 4639883 (1987-01-01), Michaelis
patent: 4840495 (1989-06-01), Bonnefoy
patent: 4946288 (1990-08-01), Siska et al.
patent: 5040381 (1991-08-01), Hazen
patent: 5088833 (1992-02-01), Tsang et al.
patent: 5090817 (1992-02-01), Ker et al.
patent: 5318361 (1994-06-01), Chase et al.
patent: 5544487 (1996-08-01), Attey et al.
patent: 5620253 (1997-04-01), Graebner et al.
"Method 1012.1 Thermal Characteristics", MIL-STD-883C, Nov. 4, 1980, (Revised Aug. 15, 1984), 7 pgs.
Example of DELPHI Process: A Plastic Quad Flat Pack (PQFP), DELPHI--Development of Libraries of Physical Models for an Integrated Design Environment, 1995, 1 pg.
"Thermal Characterication of Electronic Packages--Standardization Activities Status", Frank F. Oettinger, National Institute of Standards and Technology, EIA JEDEC JC-15 Committee on Electrical and Thermal Characterization of Semiconductor Packages and Interconnects, Sep. 26, 1991.
"EIA/JESD51-2 Integrated Circuits Thermal Test Method Environmental Conditions--Natural Convection (Still Air)", Electronics Industries Association, Dec. 19, 1995.
"EIA/JESD51-1 Integrated Circuit Thermal Measurement Method--Electrical Test Method (Single Semiconductor Device)", Electronics Industries Association, Dec. 19, 1995.
"EIA/JESD51 Methodology for the Thermal Measurement of Component Packages (Single Semiconductor Device)", Electronics Industries Association, Dec. 19, 1995.
"Fast Measurement of the Peak Junction Temperature of Power Transistors Using Electrical Method", Lu, C.Z., et al., Feb., 12-14, 1991; 1991 Proc. 7th Annual IEEE Semiconductor Thermal Measurement and Management Symp., pp. 39-43.
"Experimental Thermal Characterization of VLSI Packages", Shope, D.A., et al., Feb. 10-12, 1988; 4th Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium, pp. 19-24.
"Thermal Studies of a Plastic Dual-in-Line Package", Mithcell, C., et al., Dec. 1979; IEEE Transactions on Components, Hybrids, and Manufacturing Technology, pp. 500-511.
Doan Quyen
Gutierrez Diego
Integrated Device Technology Inc.
LandOfFree
Method for determining a thermal parameter of a device by measur does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for determining a thermal parameter of a device by measur, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for determining a thermal parameter of a device by measur will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-816729