Method for determining a preceding wafer, method for...

Details Method for determining a preceding wafer, method for... Method for determining a preceding wafer, method for...

2006-07-18

2006-07-18

Pert, Evan (Department: 2826)

Semiconductor device manufacturing: process

Including control responsive to sensed condition

Reexamination Certificate

active

07078245

ABSTRACT:
In the method for determining a preceding wafer, at least one semiconductor wafer is determined as a preceding wafer among a plurality of semiconductor wafers constituting one lot. The preceding wafer is then subjected to a given process among a plurality of processes for fabrication of a semiconductor device. The determination of the preceding wafer is based on processing results of an upstream process among the plurality of processes performed for the plurality of semiconductor wafers prior to the given process. After examination of processing results of the given process on the preceding wafer, the given process is performed for the plurality of semiconductor wafers other than the preceding wafer.

REFERENCES:
patent: 5926690 (1999-07-01), Toprac et al.
patent: 5989762 (1999-11-01), Takaoka
patent: 6485990 (2002-11-01), Lansford
patent: 2004/0167656 (2004-08-01), Yamada et al.
patent: 07-099145 (1995-04-01), None

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