Method for determination of concentration of organic additive in

Details Method for determination of concentration of organic additive in Method for determination of concentration of organic additive in

1983-01-21

1984-10-30

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204434, G01N 2746

Patent

active

044798520

ABSTRACT:
The concentration of an organic additive in a plating bath is determined by providing a polished and constant current density preplated rotating disc cathode, a reference electrode and anode in an electrolytic copper plating bath, passing an electric current from the anode to the cathode and reference electrode; measuring the voltage difference between the cathode and reference electrode; and comparing the difference to values for known concentrations of the organic additive.

REFERENCES:
patent: 3925168 (1975-12-01), Costas
patent: 4132605 (1979-01-01), Tench et al.
patent: 4146437 (1979-03-01), O'Keefe
patent: 4217189 (1980-08-01), Kerby
patent: 4324621 (1982-04-01), Kerby
Koretzky, "Increasing the Deposition Rate of Electroless Solutions", IBM Technical Disclosure Bulletin, vol. 9, No. 11, 4/67, p. 1634.
F. Mansfeld, "The Copper Plating Bath Monitor", Plating and Surface Finishing, May 1978, pp. 60-62.
M. Panmovic, "An Electrochemical Control System for Electroless Plating Bath", Journal Electrochem. Soc., Feb. 1980, pp. 365-369.

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