Method for detecting sequential processing effects using...

Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing

Reexamination Certificate

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C700S100000, C700S108000

Reexamination Certificate

active

06947804

ABSTRACT:
A method for detecting sequential processing effects on integrated circuits to be manufactured in a manufacturing process, includes: determining a first random sequence for a plurality of wafers; performing a first process step on the plurality of wafers by a first process tool in accordance with the first random sequence; determining a second random sequence for the plurality of wafers; and performing a second process step on the plurality of wafers by a second process tool in accordance with the second random sequence. The method performs randomization of wafer processing sequences at the process tool itself. By performing randomization of wafer processing sequences at the process tool, the need for separate wafer handlers is eliminated, resulting in significant cost reduction, clean-room space savings, improved yield, improved manufacturing cycle time, and improved signal-detection capabilities.

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patent: 5761065 (1998-06-01), Kittler et al.
patent: 5930138 (1999-07-01), Lin et al.
patent: 6336086 (2002-01-01), Perez et al.
patent: 6684125 (2004-01-01), Kahn et al.

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