Semiconductor device manufacturing: process – Including control responsive to sensed condition – Optical characteristic sensed
Patent
1998-09-16
2000-10-31
Bowers, Charles
Semiconductor device manufacturing: process
Including control responsive to sensed condition
Optical characteristic sensed
438800, H01L 2100
Patent
active
061401404
ABSTRACT:
A method and apparatus that uses compound processing for detecting defects in integrated circuits involves processing two portions of a semiconductor wafer differently according to a first and a second process. The first process and the second process are performed on alternating columns on the wafer. Image subtraction is used to detect differences between the layouts in adjacent columns. After differences are detected, the layout is examined to determine whether the difference represents a defect. If so, the design rules of the layout can be changed to accommodate a wider process variation.
REFERENCES:
patent: 6040912 (1998-09-01), Zika et al.
Advanced Micro Devices , Inc.
Bowers Charles
Thompson Craig
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