Method for detecting positioning errors of circuit patterns...

Photocopying – Projection printing and copying cameras – Methods

Reexamination Certificate

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C355S055000

Reexamination Certificate

active

07084962

ABSTRACT:
A method, suitable to photolithographie projection, for detecting the positioning errors of circuit patterns during the transfer by a mask into layers of a substrate of a semiconductor wafer. After the transfer of at least one multiple arrangement of a first test structure into at least one resist layer above the substrate, wherein the first test structure includes a first circuit pattern, at least one first overlay mark and at least one first micropatterned alignment mark, the values of a first positioning error of the first circuit patterns relative to the first overlay marks and the first micropatterned alignment marks are determined for each element of the at least one multiple arrangement.

REFERENCES:
patent: 5451479 (1995-09-01), Ishibashi
patent: 5601957 (1997-02-01), Mizutani et al.
patent: 5966201 (1999-10-01), Shiraishi et al.
patent: 6610448 (2003-08-01), Sato et al.
patent: 6639677 (2003-10-01), Ina et al.
patent: 6908775 (2005-06-01), Heine et al.

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