Method for detecting MIS-orientation of semiconductor packages

Details Method for detecting MIS-orientation of semiconductor packages Method for detecting MIS-orientation of semiconductor packages

1992-12-24

1994-09-13

Vo, Peter Dungba

Metal working

Method of mechanical manufacture

Electrical device making

29407, H01L 2102, B65G 4774

Patent

active

053456688

ABSTRACT:
A method for detecting orientation of a semiconductor package (11) having a cavity (19) formed in a lower surface is described. The semiconductor package (11) is positioned in a travel path (24) of a packaging process apparatus (23). An orientation support plate (17) is provided having a protrusion (18) that is designed to fit into the cavity (19) in the semiconductor package (11). The orientation support plate (17) is moved towards the semiconductor package and the protrusion (18) fits into the cavity (19) when the semiconductor package (11) is properly oriented, and the protrusion kicks the semiconductor package (11) out of the travel path (24) when the semiconductor package (11) is mis-oriented.

REFERENCES:
patent: 3559054 (1971-01-01), Bowers
patent: 3808752 (1974-05-01), Beaver et al.
patent: 4801561 (1989-01-01), Sankhagomit
patent: 4953283 (1990-09-01), Kawabata et al.
patent: 4973948 (1990-11-01), Roberts
Makosch "Testing Method" IBM Technical Disclosure Bulletin vol. 15, No. 6, Nov. 1972, pp. 1830-1831.

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