Method for detecting deterioration of solder paste printing

Details Method for detecting deterioration of solder paste printing Method for detecting deterioration of solder paste printing

1996-10-24

1998-09-22

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29832, 29846, 22818021, 22818022, H05K 334

Patent

active

058096426

ABSTRACT:
A method for detecting deterioration of solder paste printing includes defining a check pattern region on a portion of the printed circuit board PC separated from the electrical circuit, forming fine pitch check through-holes 8a in the metal mask 7 with a pitch finer than that of the electrical circuit within a region of the metal mask corresponding to the check pattern region, printing solder paste 9 onto the check pattern region through the fine pitch check through-holes of the metal mask, monitoring for defects in the printed check pattern and detecting a defect in the check pattern region before the solder paste printing onto the electrical circuit has deteriorated. The method enables maintenance of the best condition of the solder paste printing onto the electrical circuit.

REFERENCES:
patent: 4084506 (1978-04-01), Nakatani
patent: 5373786 (1994-12-01), Umaba
patent: 5492266 (1996-02-01), Hoebener et al.
patent: 5493075 (1996-02-01), Chong et al.
patent: 5564183 (1996-10-01), Satou et al.
patent: 5623872 (1997-04-01), Tomomatsu

Affiliated with

Also associated with

Rating

Method for detecting deterioration of solder paste printing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for detecting deterioration of solder paste printing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for detecting deterioration of solder paste printing will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1611498