Method for detecting and monitoring wafer probing process...

Details Method for detecting and monitoring wafer probing process... Method for detecting and monitoring wafer probing process...

2007-06-12

2007-06-12

Nguyen, Ha Tran (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S756010, C324S757020

Reexamination Certificate

active

10542873

ABSTRACT:
A system and method for detecting and monitoring wafer probe stability including the steps of, probing each die on a wafer, and for each die determining whether the result of the probe is a pass or a fail. If the result of a probe is a fail, re-probing the die and determining whether the re-probe is a pass or a fail. Once all the dies have been probed determining the rate of die re-probes that lead to passes, comparing the rate of passes on re-probes to a pre-determined limit, and if the rate of passes on re-probes is greater than the predetermined limit, assigning the probe status as unstable.

REFERENCES:
patent: 5065092 (1991-11-01), Sigler
patent: 5589765 (1996-12-01), Ohmart et al.
patent: 6043668 (2000-03-01), Carney
patent: 6127831 (2000-10-01), Khoury et al.
patent: 6281694 (2001-08-01), Tsai
patent: 05072245 (1993-03-01), None

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