Method for detecting alignment mark shielding

Details Method for detecting alignment mark shielding Method for detecting alignment mark shielding

2007-01-30

2007-01-30

Kebede, Brook (Department: 2823)

Semiconductor device manufacturing: process

With measuring or testing

C438S401000, C257SE21521

Reexamination Certificate

active

10944844

ABSTRACT:
A method of testing a test wafer includes shielding test centers on a test wafer using shielding tabs during the deposition of a layer. The test wafer has the same size and shape of product wafers. The shielding tabs are then removed from the test wafer. A plurality of predetermined points which are separated from each test center by a critical interval are checked, and whether each point is covered by the layer is determined through an interferometer or a microprobe. The test wafer is processed after adjustments to or maintenance on equipment, or after a fixed number of product wafers have been processed.

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patent: 6277658 (2001-08-01), Jeng et al.
patent: 6492269 (2002-12-01), Liu et al.

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