Method for designing wiring connecting section and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

Reexamination Certificate

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C257S775000, C438S637000

Reexamination Certificate

active

07005746

ABSTRACT:
First, an amount of a current flowing between a first wiring and a third wiring is estimated, and the number of stack vias required for connecting the first wiring and the third wiring is determined. Next, based on the number of stack vias, the number of virtual wirings for determining positions of the stack vias is determined. Thereafter, the virtual wirings are arranged in a forming region of the third wiring above the first wiring, for example, at an equal interval, and the stack vias are created in intersections of the first wiring and the virtual wirings. Thereafter, the virtual wirings are removed, and the third wiring is created. According to needs, a second wiring passing between the stack vias is created.

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Office Communication from the Patent Office of the People's Republic of China dated Apr. 30, 2004 in Application No. 02105977.2 with English language translation.

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