Method for deposition tool cleaning

Details Method for deposition tool cleaning Method for deposition tool cleaning

1998-04-23

2000-05-30

Gulakowski, Randy

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

134 1, 134 12, 134 2, 134 3, 134 19, 134 21, 134 221, 134 2214, 134 2219, 134 36, 134 41, 134 42, 156345, 156643, 216 67, 216 68, 438710, G08B 600

Patent

active

060679999

ABSTRACT:
A method of cleaning a deposition tool to control and minimize emission of environmentally deleterious materials includes the steps of: a) establishing a predetermined temperature in a processing chamber; b) providing a mixture of between 15 and 25 percent nitrogen trifluoride in helium at a mixture flow rate of more than 550 standard cubic centimeters per minute (sccm); c) establishing a high pressure of 1.5 to 9.5 torr in the processing chamber; d) establishing a plasma in the processing chamber, e) establishing a low pressure in the processing chamber of 2 torr or less; and f) establishing a plasma in the processing chamber. Instead of a two-step cleaning method, the method may alternatively be executed as a one-step cleaning method. Either method may be optimized by, among other things, providing 19% nitrogen trifluoride. The two-step method may also be optimized by providing a high pressure of about 7 to 9.5 torr and a low pressure of about 1.5 torr.

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