Method for depositing thin film using plasma chemical vapor...

Coating processes – Interior of hollow article coating – Coating by vapor – gas – mist – or smoke

Reexamination Certificate

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C427S535000, C427S578000, C427S579000, C427S255370, C134S001100

Reexamination Certificate

active

06911233

ABSTRACT:
A thin film deposition method using plasma enhanced chemical vapor deposition is described. In a plasma enhanced chemical vapor deposition chamber, plasma is used to enhance the chemical reaction to form a thin film on a substrate. The substrate is then removed, followed by passing a cleaning gas into the chamber to remove residues in the chamber. Before loading another batch of substrate in the chamber, a pre-deposition process is performed to isolate contaminants generated from the cleaning process. A discharge plasma treatment is then conducted to lower the amount of accumulated electrical charges.

REFERENCES:
patent: 5632821 (1997-05-01), Doi
patent: 5824375 (1998-10-01), Gupta

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