Method for depositing solder paste on a pad

Details Method for depositing solder paste on a pad Method for depositing solder paste on a pad

1999-03-17

2000-08-01

Gutierrez, Diego

Geometrical instruments

Gauge

Template

22818022, 101127, G01B 514, F23J 300

Patent

active

060948329

ABSTRACT:
Solder paste is deposited using a solder stencil with an aperture having a concave edge in order to reduce the formation of solder balls. The solder deposit may be formed on a pad such that the paste has a concave edge. Solder paste deposits may be made on adjacent pads with the concave surfaces facing one another.

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Surface Mount International Conference And Exposition, Conventional Center, San Antonio, CA, 8/29/9.

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