Metal fusion bonding – Process – Plural joints
Reexamination Certificate
2011-05-24
2011-05-24
Stoner, Kiley (Department: 1735)
Metal fusion bonding
Process
Plural joints
C228S248100
Reexamination Certificate
active
07946470
ABSTRACT:
A method for accurately depositing a required volume of solder material on a specific area of a lead frame, substrate or other part of an electronic component to be bonded by reflow of solder material to another part into a reliable, void-free connection during a subsequent assembly step comprises the following steps. Minute particles of solder material whose cumulative volume corresponds to the total volume to be deposited are loaded into a cavity cut into a fixture made from a material such as graphite. The cavity delineates the specific area of deposit. The part is then laid upon the fixture and immobilized thereon by a cover made from a material such as graphite. The fixture and its enclosed part are then subjected to solder material melting temperature under a controlled atmosphere in a furnace. The cavity is patterned and dimensioned to accommodate the right number of uniformly dimensioned particles necessary to precisely create the desired deposit of solder material.
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Huth Kenneth J.
Monterulo Lawrence C.
Charmasson & Buchaca & Leach, LLP
Gamino Carlos
Semx Corporation
Stoner Kiley
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