Method for depositing electroless nickel phosphorus alloys

Details Method for depositing electroless nickel phosphorus alloys Method for depositing electroless nickel phosphorus alloys

1998-08-28

2000-02-01

Talbot, Brian K.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427305, 427438, 4274431, B05D 512

Patent

active

060200219

ABSTRACT:
Method for plating an electroless nickel phosphorus containing alloy deposit on a substrate where the deposit has a high weight percent of phosphorus above 8 or 10 weigh percent and is plated at high deposition rates above 10 and up to 25 micrometers per hour and where the plating deposition is conducted in the presence of a nickel chelating agent having a stability constant, log K.sub.a, above 3 such as citric acid and at a pH of from about 5.0 to about 8.0.

REFERENCES:
patent: 4397812 (1983-08-01), Mallory
patent: 4483711 (1984-11-01), Harbulak et al.
patent: 5258061 (1993-11-01), Martyak et al.
Robert M. Smith and Arthur E. Martell, Critical Stability Constants, Plemumn Press, New York vol. 5 First Supplement no month available 1982 p. 329.

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