Method for depositing a solderable metal layer by an electroless

Details Method for depositing a solderable metal layer by an electroless Method for depositing a solderable metal layer by an electroless

1988-02-19

1989-04-25

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 58, 4274431, 427304, 427305, B05D 512

Patent

active

048246930

ABSTRACT:
To deposit a solderable metal layer on conductive paths (4) of ITO on substrates of display devices (1) by an electroless method, the conductive paths are activated, prior to the deposition, and the areas not covered by the conductive paths are subsequently inactivated. The activated paths are then metallized with a solderable metal layer so that integrated circuits can be soldered to the metallized conductive paths.

REFERENCES:
patent: 3041198 (1962-06-01), Certa
patent: 4321283 (1982-03-01), Patel
patent: 4478690 (1984-10-01), Scholtens
patent: 4666078 (1987-05-01), Ohno
patent: 4726965 (1988-02-01), Zondler

Affiliated with

Also associated with

Rating

Method for depositing a solderable metal layer by an electroless does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for depositing a solderable metal layer by an electroless, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for depositing a solderable metal layer by an electroless will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1195007