Semiconductor device manufacturing: process – Gettering of substrate – By implanting or irradiating
Reexamination Certificate
2011-08-16
2011-08-16
Trinh, Michael (Department: 2822)
Semiconductor device manufacturing: process
Gettering of substrate
By implanting or irradiating
C438S482000, C438S486000, C438S487000, C257SE21134
Reexamination Certificate
active
07998841
ABSTRACT:
A dehydrogenation treatment method which includes forming a hydrogenated amorphous silicon film above a non-heat-resistant substrate, and eliminating bonded hydrogen from the hydrogenated amorphous silicon film by irradiating an atmospheric thermal plasma discharge to the hydrogenated amorphous silicon film for a time period of 1 to 500 ms. The surface of the substrate is heated at a temperature of 1000 to 2000° C. by irradiating the atmospheric thermal plasma discharge.
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Azuma Kazufumi
Shirai Hajime
Advanced LCD Technologies Development Center Co. Ltd.
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
Trinh Michael
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