Metal fusion bonding – Process – Applying or distributing fused filler
Patent
1992-11-23
1994-02-22
Bradley, Paula A.
Metal fusion bonding
Process
Applying or distributing fused filler
427241, 228102, B23K 108, B23K 1018
Patent
active
052880095
ABSTRACT:
The method comprises the steps of providing a vessel for containing a solder melt, and a bowl having a horizontal upper rim with an upwardly directed edge extending therealong; immersing the bowl in the solder melt contained in the vessel; lifting the bowl to a position where at least the upper rim is located above the solder melt contained in the vessel, whereby molten solder is drawn by the bowl; dipping conductive elements of a device into the molten solder drawn by the bowl; separating the conductive elements from the molten solder drawn by the bowl; and, immediately after the separation, spinning the device about a substantially vertical axis. The spinning step comprises a first phase of submitting the device to a selected angular acceleration, a second phase, having a selected duration of spinning the device at a selected maximum rotational velocity, and a third phase submitting the device to a selected angular deceleration.
REFERENCES:
patent: 3269633 (1966-08-01), Bernier et al.
patent: 3359132 (1967-12-01), Wittmann
patent: 5024366 (1991-06-01), Kim
Chevalier Claude
Corlay Christian
Germain Jean-Claude
Bradley Paula A.
Carrar
Elpel Jeanne M.
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