Etching a substrate: processes – Forming or treating electrical conductor article
Reexamination Certificate
2006-09-26
2010-02-23
Alanko, Anita K (Department: 1792)
Etching a substrate: processes
Forming or treating electrical conductor article
C216S014000, C216S021000, C216S057000, C216S067000, C216S083000, C438S108000, C438S704000
Reexamination Certificate
active
07666321
ABSTRACT:
A method for decapsulating a package is provided. The method comprises steps of providing a package having a chip therein, wherein the chip has an active surface and a rear surface. Further, the package further comprises a heat sink, a plurality of solder bumps, a substrate, an underfill and a plurality of solder balls. The method further comprises removing the heat sink and removing the substrate together with the solder balls. A dry etching process is performed to remove a portion of the underfill. A wet etching process is performed to remove the rest portion of the underfill. A thermal process solder bump removal process is performed to melt the solder bumps and then a solder bump removal process is performed to remove the melted solder bumps from the active surface of the chip.
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Alanko Anita K
Hsu Winston
United Microelectronics Corp.
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