Method for debossing and selectively aperturing a resilient plas

Plastic and nonmetallic article shaping or treating: processes – Direct application of fluid pressure differential to... – Perforation by differential fluid pressure; or smoothing,...

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264154, 264284, 264555, 428131, B29C 5102, B29C 5110, B29C 5906

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active

047479914

ABSTRACT:
Method for imparting a selectively apertured three-dimensional pattern to a heated plastic material which is either fed in film form from a supply roll or extruded as a melt directly onto the surface of a forming structure and subjected to a fluid pressure differential while in contact with its surface. In a preferred embodiment, the film forming structure comprises a stacked laminate of initially imperforate planar sheets having continuous patterns of apertures therein and at least one initially perforate selectively apertured planar sheet located beneath the uppermost continuously apertured sheet. The laminate forming structure is preferably tubular in shape so as to facilitate continuous plastic web processing against its outermost surface. Film to be debossed and selectively apertured is brought in contacting relation with the laminate structure and subjected to a substantially uniform fluid pressure differential on said forming structure while at a temperature above its softening temperature. The fluid pressure causes the heated plastic film to be debossed in those areas where said initially perforate selectively apertured lamina contacts the film and debossed and apertured in those areas where said initially perforate selectively apertured lamina does not contact the film. The debossed and selectively apertured film is thereafter cooled below its softening temperature before removal from the forming structure.

REFERENCES:
patent: Re23910 (1954-12-01), Smith et al.
patent: Re29524 (1978-01-01), Spencer
patent: 691804 (1902-01-01), Parker
patent: 2166366 (1939-07-01), Norris
patent: 2354916 (1944-08-01), Hurt
patent: 2776452 (1957-01-01), Chavannes
patent: 2809392 (1957-10-01), Armstrong
patent: 2816025 (1957-12-01), Dahlberg
patent: 2820985 (1958-01-01), Cresswell
patent: 2857657 (1958-10-01), Wheeler, Jr.
patent: 2926490 (1960-03-01), Eaton et al.
patent: 2940125 (1960-06-01), Beucker
patent: 3054148 (1962-09-01), Zimmerli
patent: 3123446 (1964-03-01), Wheeler, Jr.
patent: 3170394 (1965-02-01), Levin
patent: 3174837 (1965-03-01), Mears
patent: 3177970 (1965-04-01), Boschi
patent: 3312583 (1967-04-01), Rochlis
patent: 3390447 (1968-07-01), Mears
patent: 3489154 (1970-01-01), Kaspar et al.
patent: 3560601 (1971-02-01), Johnson et al.
patent: 3681182 (1972-08-01), Kalwaites
patent: 3814101 (1974-06-01), Kozak
patent: 3844027 (1974-10-01), Hagen et al.
patent: 3900629 (1975-08-01), Spencer
patent: 3929135 (1975-12-01), Thompson
patent: 3957414 (1976-05-01), Bussey, Jr. et al.
patent: 3979494 (1976-09-01), Ericson
patent: 3989867 (1976-11-01), Sisson
patent: 4038040 (1977-07-01), Nagl
patent: 4041951 (1977-08-01), Sanford
patent: 4091925 (1978-05-01), Griffo et al.
patent: 4151240 (1979-04-01), Lucas et al.
patent: 4155693 (1979-05-01), Raley
patent: 4248822 (1981-02-01), Schmidt
patent: 4317792 (1982-03-01), Raley et al.
patent: 4342314 (1982-08-01), Radel

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