Cutting – Processes – With subsequent handling
Patent
1992-11-10
1994-04-05
Phan, Hien H.
Cutting
Processes
With subsequent handling
83 42, 83113, 83277, B23D 5104, B26D 706
Patent
active
052994805
ABSTRACT:
A method for cutting at least one elongated workpiece (13b) with a saw head assembly (10b) having a cutting blade (11b). The saw assembly (10b) further includes a guide mechanism for providing relative guided movement between the cutting blade (11b) and the workpiece (13b) along a cutting line (14b). The method comprises the steps of placing the workpiece (13b) across the cutting line (14b). Further, moving at least one of the cutting blade (11b) and the workpiece (13b) along the cutting line (14b) from a starting position (28b) on one side (27b') of said workpiece (13b) to a parked position (37b) on an opposite side (27b) of the workpiece (13b). In the parked position, the entire cutting stretch is positioned beyond the workpiece (13b). Next, the cut part or portion (32b) is displaced away from the cutting line (14b) using the workpiece (13b), while the cutting blade (11b) is in the parked position (37b). Thereafter, the workpiece (13b) is returned to the opposite side of the cutting line (14b), and the cutting blade (11b) is returned from the parked position (37b) to the starting position (28b). Accordingly, the cut parts (32b) and the workpiece (13b) are repositioned away from the cutting kerf (15b), which prevents their contact with the cutting blade (11b) during return of the cutting blade (11b) to the starting position (28b).
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Harris Gerald R.
Richards Mark P.
HEM, Inc.
Phan Hien H.
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