Method for cutting wafers from a crystal

Details Method for cutting wafers from a crystal Method for cutting wafers from a crystal

1997-08-12

1999-09-07

Eley, Timothy V.

Stone working

Sawing

125 1602, 125 21, B28D 108

Patent

active

059471026

ABSTRACT:
A sawing suspension composition is composed of an essentially nonaqueous or anhydrous organic liquid in which hard-material particles are dispersed. The liquid is selected from a group of compounds which comprises low molecular weight polyglycols and any desired mixture of these polyglycols. The sawing suspension is used in conjunction with a wire saw for cutting wafers from a crystal of a brittle and hard material.

REFERENCES:
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patent: 4853140 (1989-08-01), Payne et al.
patent: 5695384 (1997-12-01), Beratan
patent: 5817711 (1998-10-01), Kambe et al.
Derwent Abstract corresponding to EP 0 686 684 (#56-021505).
Derwent Abstract corresponding to JP 04218537 (#52-312572).
Database WPI, Section Ch, Week 9238, Derwent Publications Ltd., London, GB lass A97, AN 92-312512 XP0020508G1 & JP 04 218 594 A (Nippon Steel).
Patent Abstracts of Japan vol. 006, No. 090 (C-104) & JP 57021495 A (Mitshubishi Metal Corp).
Derwent Abstract (96-021905) corresponding to EP 0 686 684 A1.
Derwent Abstract (96-426856) corresponding to EP 0 733 429 A1.

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