Method for cutting tape carrier packages of a LCD and LCD...

Liquid crystal cells – elements and systems – Particular structure – Having significant detail of cell structure only

Reexamination Certificate

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Details

C029S592100, C029S825000, C029S827000, C029S830000, C029S832000, C029S840000, C349S150000, C349S152000

Reexamination Certificate

active

06778247

ABSTRACT:

The present application is a 35 U.S.C. § 119 utility application from, and claims priority to, Taiwanese application 90127511, filed Nov. 6, 2001, which application is incorporated herein in its entirety by this reference.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a liquid crystal display, and more particularly to an improved liquid crystal display apparatus and method for checking the joining accuracy thereof.
2. Description of the Related Art
Conventionally, a liquid crystal display apparatus comprises a panel, a drive circuit and a control circuit. The pixels on the panel are driven by the drive circuit and the control circuit is designed to manipulate the drive circuit to control images displayed on the panel. In a liquid crystal display apparatus, the drive circuit is generally set on tape carrier packages (TCP) and the control circuit is laid out on a control circuit board. The TCP is coupled to the panel and the control circuit is coupled to the TCP, wherein the pins on the control circuit are constrained in a predetermined ring to correspond with pins on the TCP to maintain the display quality of the liquid crystal apparatus.
FIG. 1
shows the conventional circuit layout of TCP. The TCP circuit is printed on a film
10
. The driving chip
11
provides driving signals of a panel. One terminal of the TCP OLB pads
12
is connected to the driving chip
11
, and the other terminal is connected to the responding testing pad
14
. Electric testing is performed to confirm that OLB pads connected to the driving chip
11
are not shorted or broken. After electric testing, the cutting of the film
10
is performed. The cutting region is the rectangle region indicated by number
16
. After the cutting, the remained part does not include testing pads
14
.
FIG. 2
shows one conventional example of the circuit layout between the color filter
20
and the matrix glass
21
. As shown in
FIG. 2
, the layouts of the cell OLB pad
220
on the conventional wiring layer
22
are straight lines.
Next, the OLB pads
12
of the cut TCP circuit
16
are connected to the corresponding output lead
220
of the wiring layer
22
. Thus, the driving chip
11
is connected to the LCD panel.
However, the layout of the output lead
220
of the wiring layer
22
is not suited for straight layout presently because circuit layouts are getting more complicated and the allowed layout region is getting smaller. Thus, the direction of some part of the layout is horizontal or oblique.
FIG. 3
shows another conventional example of the circuit layout between the color filter
20
and the matrix glass
21
. As shown in
FIG. 3
, the layouts of the cell OLB pad
220
comprise straight layout
321
A and the horizontal or oblique layout
321
B.
Thus, electric shorts occur when the OLB pads
12
of the cut TCP circuit
16
in
FIG. 1
are connected to the corresponding output lead
320
of the wiring layer
32
.
FIG. 4
shows the TCP circuit
16
located on the wiring layer
32
of an LCD. The number
40
represents the combining region of the TCP circuit
16
and the wiring layer
32
of an LCD panel. The number
42
represents the TCP OLB pads
12
of the TCP circuit
16
shorting with the horizontal or oblique layout
321
B of the wiring layer
32
.
To solve the short problem, the conventional method changes the layout of the wiring layer
32
. However, as the allowed layout region gets smaller, it is difficult to avoid electric shorts by changing layout.
SUMMARY OF THE INVENTION
The object of the present invention is to provide an LCD structure and a cutting method of tap carrier package of a liquid crystal display by cutting the structure of the tap carrier package to avoid electric shorts in the combining region of the TCP circuit and the wiring layer of the LCD panel.
To achieve the above-mentioned object, the present invention provides a cutting method of tap carrier package of a liquid crystal display. The cutting method cuts a film comprising a first straight layout along a predetermined direction on a wiring layer comprising a second straight layout along the predetermined direction and a oblique layout, the method comprising the following steps. First, a breach is formed by cutting a part of the first straight layout on the film. Finally, the film is fastened on the wiring layer. Thus, the remaining first straight layout is only connected to the straight layout and the oblique layout is exposed through the breach.
Moreover, the present provides a liquid crystal display, comprising a panel, a wiring layer, and a tap carrier package. The wiring layer has a first layout comprising a straight layout along a predetermined direction and an oblique layout. The tap carrier package has a breach and a second layout along the predetermined direction. The tap carrier package is located on the wiring layer, the second layout is coupled to the straight layout and the oblique layout is exposed through the breach.


REFERENCES:
patent: 4801561 (1989-01-01), Sankhagowit
patent: 5075252 (1991-12-01), Schendelman
patent: 5162265 (1992-11-01), Roth
patent: 5448387 (1995-09-01), Kurokawa et al.
patent: 5572346 (1996-11-01), Sakamoto et al.
patent: 5680191 (1997-10-01), Voisin et al.
patent: 5724056 (1998-03-01), Kato
patent: 5777855 (1998-07-01), Yokajty
patent: 5818562 (1998-10-01), Yoon
patent: 5949512 (1999-09-01), Taguchi
patent: 6050830 (2000-04-01), Tanaka
patent: 6123551 (2000-09-01), Westfall
patent: 6133978 (2000-10-01), Tajima
patent: 6172732 (2001-01-01), Hayakawa et al.
patent: 6191838 (2001-02-01), Muramatsu
patent: 6300997 (2001-10-01), Saito et al.
patent: 6396557 (2002-05-01), Tajima
patent: 6407796 (2002-06-01), Tajima et al.
patent: 6417897 (2002-07-01), Hashimoto
patent: 6495768 (2002-12-01), Cho
patent: 2001/0020996 (2001-09-01), Ueda et al.
patent: 02285663 (1990-11-01), None

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