Cutting – Other than completely through work thickness or through work... – Scoring
Reexamination Certificate
2000-01-27
2002-05-14
Peterson, Kenneth E. (Department: 3724)
Cutting
Other than completely through work thickness or through work...
Scoring
C083S879000, C083S039000
Reexamination Certificate
active
06386084
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a method for producing color filters used mainly in flat panel displays such as liquid crystal displays or the like and, more particularly, to a method for cutting a substrate.
2. Related Background Art
The conventional color filters used mainly in the flat panel displays such as the liquid crystal displays or the like were produced by a pigment dispersion method. As against it, a method by ink jet was proposed recently as a method for producing the color filters, which was able to improve the device cost and throughput. These color filter producing methods employed a so-called multiple production process of forming a plurality of color filters on a single substrate and cutting the substrate into individual color filters at a relatively late stage in the production process, thereby improving the productivity. In this case, the cutting of the color filter substrate was carried out by a scribe method conventionally known. It was common practice to carry out scribe working while maintaining working conditions constant in working of one scribe line from beginning to end. For scribing vertical and horizontal scribe lines, the scribe working conditions were constant regardless of their scribe directions.
Incidentally, in the case of the color filters produced by the ink jet method, there were cases wherein in the working under the ordinary constant conditions creation of a median crack became instable, particularly, at a cross point of intersection between scribe lines, or the like, thereby resulting in decreasing the yield.
This is conceivably due to the following reason.
Specifically, the color filters by the ink jet method, when produced by cutting of the color filter substrate, are different in the film structure at the part of a cut line from the color filters by the conventional pigment dispersion method. Describing this in more detail, only a protective film layer is present at the cut line in most cases of the cutting of the color filters by the conventional pigment dispersion method, whereas there exist two-layered films, an ink receiving layer and a protective film layer, in the case of the color filters by the ink jet method.
For this reason, in the working under the ordinary constant conditions there are cases wherein a cutter jump occurs upon a scribing start because of a chamfer shape at the edge of the substrate or at the cross point between vertical and horizontal scribe lines so as to cause a scribe cutter to run onto the film and a considerable time is thus necessary before restart of creation of the median crack. This makes the scribe line instable, for example, causing oblique rupture from the cross point or the like. This is assumed to cause the decrease of the yield.
According to further studies, there also arose the problem of the decrease of yield due to the oblique rupture or the like similarly in the case of the color filters by the pigment dispersion method, though there was a difference between their degrees.
This technique is also effective for increasing the working yield not only for color filters but for array substrate or cell cutting.
SUMMARY OF THE INVENTION
The present invention has been accomplished in view of the problem in the above conventional examples, and an object of the present invention is to solve the above problem of the instable creation of median crack, thereby providing a substrate cutting method capable of increasing the working yield.
A substrate cutting method of the present invention is a method for cutting a substrate by scribing a scribe line therein, wherein a working condition of the scribe line is varied during scribe working of one line.
A further substrate cutting method of the present invention is a method for scribing at least two scribe lines crossing each other, in the substrate, wherein a working condition of one scribe line is different from that of the other scribe line.
REFERENCES:
patent: 3880028 (1975-04-01), Frederick, Jr.
patent: 4226153 (1980-10-01), Insolio
patent: 4392404 (1983-07-01), Schwarzenberg et al.
patent: 5038654 (1991-08-01), Mackey
patent: 5381713 (1995-01-01), Smith
patent: 5860349 (1999-01-01), Takeda
patent: 6021696 (2000-02-01), Inao
patent: 6105483 (2000-08-01), Takeda
Fitzpatrick ,Cella, Harper & Scinto
Flores-Sánchez Omar
Peterson Kenneth E.
LandOfFree
Method for cutting substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for cutting substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for cutting substrate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2873485