Method for cutting protective tape of semiconductor wafer...

Details Method for cutting protective tape of semiconductor wafer... Method for cutting protective tape of semiconductor wafer...

2007-11-09

2011-10-25

Nguyen, Phong H (Department: 3724)

Cutting

With means to monitor and control operation

C083S076100, C083S076600, C083S582000

Reexamination Certificate

active

08042441

ABSTRACT:
A cutter blade movably in a radial direction of a wafer is pressed for biasing to an outer circumferential edge of the semiconductor wafer. Simultaneously, the pushing biasing force of the cutter blade is controlled constant with automatic regulation corresponding to a traveling speed variation of the cutter blade, so that effect of a centrifugal force that works at the time of rotating travel of the cutter blade may not vary a pushing biasing force of the cutter blade. As a result, a contact pressure of the cutter blade to the outer circumferential edge of the semiconductor wafer is maintained stable.

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The First Office Action for the Application No. 200710187868.7 from The State Intellectual Property Office of the People's Republic of China dated May 17, 2010.

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