Method for cutting lead wires

Details Method for cutting lead wires Method for cutting lead wires

1980-09-22

1984-03-13

Yost, Frank T.

Cutting

Processes

83174, 834092, 83411R, 83676, B23D 1900, B23D 3500

Patent

active

044360061

ABSTRACT:
A cutting method comprising using a main body in the form of a circular disk and a hard layer provided on one surface of the main body and having a thickness of 0.02 to 0.2 mm. The hard layer is made of cemented carbides, TiC TaC, Cr.sub.2 C.sub.3, Al.sub.2 O.sub.3 or the like, while the main body is made of a material, such as steel, non-ferrous metal or plastics, which is lower than the hard layer in abrasion resistance. The hard layer is formed along its outer periphery with a cutting edge which is self-sharpened when chipped.

REFERENCES:
patent: 1607879 (1926-11-01), Drucker
patent: 2619142 (1952-11-01), Ditting
patent: 2894583 (1959-07-01), Johnstad
patent: 2931407 (1960-04-01), Erickson
patent: 3122958 (1964-03-01), Washburn
patent: 3541910 (1970-11-01), Murray
patent: 3882749 (1975-05-01), Tourek
patent: 3894462 (1975-07-01), Lundtoft
patent: 3974727 (1976-08-01), Stehlin
patent: 4072077 (1978-02-01), Morgan
patent: 4173160 (1979-11-01), Hess

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