Method for cutting a single crystal ingot

Details Method for cutting a single crystal ingot Method for cutting a single crystal ingot

2007-06-12

2007-06-12

Ackun, Jr., Jacob K. (Department: 3723)

Stone working

Sawing

Endless

C083S062100

Reexamination Certificate

active

11350583

ABSTRACT:
The object of the present invention is to provide a method whereby it is possible to cut a single crystal ingot comparatively accurately while allowing resulting slices to have a flat surface, and to lengthen the life of the blade more than would be possible with conventional methods. A single crystal ingot10ais arranged below a straightly running portion18aof the blade which is made to run endlessly along a circuit such that the longitudinal axis of ingot10acrosses at right angles with the straightly running portion18aof the blade, thereby enabling the straightly running portion18aof the blade to cut the ingot10aperpendicularly. If the blade is inclined to one side, the cutting machine detects a shift A between the uppermost end of cut surface10band its lowermost end projected to the longitudinal axis of ingot, and corrects the inclination of the blade by tilting the imaginary cut surface10cincluding the straightly running portion of the blade in the opposite direction by an angle with respect to a line vertical to the longitudinal axis of ingot10asuch that shift B is equal to shift A. Subsequent to correction, cutting is further continued with the straightly running portion18aof the blade whose inclination has been just corrected.

REFERENCES:
patent: 4289053 (1981-09-01), Sawamura
patent: 4355555 (1982-10-01), Kobayashi et al.
patent: 5070751 (1991-12-01), Harris
patent: 5616065 (1997-04-01), Egglhuber
patent: 6021772 (2000-02-01), Seifert et al.
patent: 2001/0002561 (2001-06-01), Shiraga et al.

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