Method for customizing nucleate boiling heat transfer from elect

Heat exchange – Regenerator – Checker brick structure

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62527, 165 96, 165133, 165DIG3, 219121EB, 219121LM, 357 82, F28D 500, F28F 1318

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active

040505073

ABSTRACT:
A method is provided for customizing the heat transfer from the walls of an electronic unit such as a semi-conductor chip or wafer by determining the required heat transfer characteristics of the units; drilling holes of a predetermined size and location in the walls of the unit with a high energy beam in accordance with the required heat transfer characteristics of the unit; immersing the unit in a suitable dielectric coolant so that nucleate boiling will start at approximately the desired wall temperature to obtain the required heat transfer from the unit, thereby providing a uniform wall temperature.
A further aspect of the invention is the inclusion of a heater means located at or near the bottom of the heat transfer wall so that bubble generation can be started thereat, which bubbles wash the liquid from the downstream drilled holes or natural nucleation sites, thereby starting nucleate boiling when the required temperature is reached.

REFERENCES:
patent: 3207209 (1965-08-01), Hummel
patent: 3301314 (1967-01-01), Gaertner
patent: 3410979 (1968-11-01), Larsson
patent: 3684007 (1972-08-01), Ragi
patent: 3741292 (1973-06-01), Aakalu et al.
Haun, Jr., Laser Applications, IEEE Spectrum, May 1968.
Chu et al., IBM Technical Dislosure Bulletin, vol. 11, No. 3, Aug. 1968.

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