Method for creating on-package inductors for use with integrated

Details Method for creating on-package inductors for use with integrated Method for creating on-package inductors for use with integrated

1997-07-10

1998-11-24

Eley, Timothy V.

Metal working

Method of mechanical manufacture

Electrical device making

336221, H01F 706

Patent

active

058391843

ABSTRACT:
A method is described for creating an inductor in the package for an integrated circuit. The inductor is formed by utilizing one or more of the bond leads as the core of the inductor and by winding a series of coils about the core in connection either with the bond pads of the integrated circuit itself or to other bond leads for connection outside the integrated circuit chip.

REFERENCES:
patent: 5418514 (1995-05-01), Smith et al.

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