Etching a substrate: processes – Nongaseous phase etching of substrate – Etching inorganic substrate
Patent
1995-05-22
1997-06-03
Silverberg, Sam
Etching a substrate: processes
Nongaseous phase etching of substrate
Etching inorganic substrate
216105, B44C 122
Patent
active
056350848
ABSTRACT:
A method for treating the surface of aluminum alloys hang a relatively high copper content is provided which includes the steps of removing substantially all of the copper from the surface, contacting the surface with a first solution containing cerium, electrically charging the surface while contacting the surface in an aqueous molybdate solution, and contacting the surface with a second solution containing cerium. The copper is substantially removed from the surface in the first step either by (i) contacting the surface with an acidic chromate solution or by (ii) contacting the surface with an acidic nitrate solution while subjecting the surface to an electric potential. The corrosion-resistant surface resulting from the invention is excellent, consistent and uniform throughout the surface. Surfaces treated by the invention may often be certified for use in salt-water services.
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Lin Simon H.
Mansfeld Florian B.
Wang You
Anderson Denton L.
Farah David A.
Silverberg Sam
University of Southern California
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