Method for creating a bond enhancement layer for thermoplastic u

Details Method for creating a bond enhancement layer for thermoplastic u Method for creating a bond enhancement layer for thermoplastic u

1996-02-29

2000-08-08

Silbaugh, Jan H.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156280, 156290, 1563066, B29D 2400

Patent

active

060996803

ABSTRACT:
Methods of improving the bondability of thermoplastic plastic substrates are described. In the methods, a bondable substrate is adhered to a thermoplastic plastic material of choice through mechanical, thermal, or chemical procedures, resulting in bond-enhanced thermoplastic materials. In one example, a urethane honeycomb panel with bond enhancement substrates is described. Thermoplastic panels with bond enhancement layers are laminated to secondary materials such as metal or plastic by applying an adhesive to the bond enhancement layer and adhering the secondary material.

REFERENCES:
patent: 3137604 (1964-06-01), Bosch
patent: 4084366 (1978-04-01), Saylor et al.
patent: 4353947 (1982-10-01), Northcutt
patent: 4496024 (1985-01-01), Wolf et al.
patent: 4800119 (1989-01-01), Kolar
Kirk-Othmer Encyclopedia of Chemical Technology, Martin Grayson, Executive Editor, Wiley-Interscience, John Wiley and Sons, NY, vol. 18, pp. 184-185.

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