Method for cracking brittle material

Details Method for cracking brittle material Method for cracking brittle material

1975-09-29

1978-01-17

Yost, Frank T.

Severing by tearing or breaking

Methods

225 2, 225 965, 225103, B26F 300

Patent

active

040687880

ABSTRACT:
A machine for separating a sheet of brittle material, for example a semiconductor wafer, into a plurality of pellets is disclosed. The pellets are defined by a plurality of intersecting scribed lines on the sheet. The machine includes a member for applying a shear force to an edge of the sheet whereby the maximum bending moment is applied at a preselected scribe line. The machine is particularly applicable for use with those semiconductor wafers which have a solder coating on both sides.

REFERENCES:
patent: 2659950 (1953-11-01), West
patent: 3149765 (1964-09-01), Horning et al.
patent: 3565306 (1971-02-01), St. Louis
patent: 3602410 (1971-08-01), Dennis et al.
patent: 3790051 (1974-02-01), Moore
patent: 3870196 (1975-03-01), Hargraves

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