Severing by tearing or breaking – Methods – With preliminary weakening
Patent
1979-04-10
1981-01-27
Yost, Frank T.
Severing by tearing or breaking
Methods
With preliminary weakening
225 965, B26F 300
Patent
active
042470315
ABSTRACT:
A method for protecting electronic circuitry formed on the obverse side of a wafer from flying debris produced either by the mechanical or laser scribing or scoring of the wafer and during separation. The device is provided with a layer of abrasion resistant material on the circuit side of the wafer and the scribing or scoring is done on the obverse side of the wafer. The cracking operation is performed by applying pressure to the wafer in such a manner as to have the reverse side in tension and the obverse or circuit side in compression in order to prevent any debris which may have been cast up during the scribing or scoring operation from contaminating or damaging the circuit side of the wafer while any debris cast up during the breaking operation is thrown away from the obverse or circuit side.
REFERENCES:
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patent: 3222963 (1965-12-01), Nabiullin et al.
patent: 3392440 (1968-07-01), Yanagawa
patent: 3461537 (1969-08-01), Lotz
patent: 3493155 (1970-02-01), Litant et al.
patent: 3507426 (1970-04-01), Bielen et al.
patent: 3542266 (1970-11-01), Woelfle
patent: 3601296 (1971-08-01), Pick
patent: 3677875 (1972-07-01), Althouse
Ham William E.
Pote Thomas W.
Benjamin Lawrence P.
Cohen D. S.
Morris Birgit E.
RCA Corporation
Yost Frank T.
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