Method for covering a microfluidic assembly

Details Method for covering a microfluidic assembly Method for covering a microfluidic assembly

2001-01-22

2009-06-30

Warden, Jill (Department: 1797)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C422S105000, C422S105000, C422S091000, C156S308200, C156S309600, C436S180000

Reexamination Certificate

active

07553393

ABSTRACT:
A method for covering a set of open microchannel structures which are fabricated on a planar surface made of plastics and which comprise two or more part areas that have different surface characteristics. The method comprises the steps of: a) providing the surface comprising the set of microchannel structures; b) providing a lid-forming sheet having on one side an even layer of a thermoglue; c) applying the side of the sheet having the thermoglue against the surface carrying the microchannel structure; d) heating the assembly created in step (c) to selectively liquefy the hot-melt adhesive while at the same time pressing the sheet material and the planar surface of the substrate together; e) permitting the resulting laminate-covered microchannel structure to cool. An assembly comprising (a) a planar substrate, the surface of which has a set of one or more open microchannel structures each of which comprises part areas representing different functionalities, and (b) a lid-forming material covering said set of microchannel structures and having one or more openings going from a microchannel structure to ambient atmosphere. The assembly is characterized in that the joint between said surface and said sheet material is a thermoglue that possibly has been cured.

REFERENCES:
patent: 3553067 (1971-01-01), Dwyer et al.
patent: 5376252 (1994-12-01), Ekstrom
patent: 5690841 (1997-11-01), Elderstig
patent: 5698363 (1997-12-01), Katsuda et al.
patent: 5773488 (1998-06-01), Allmer
patent: 5885527 (1999-03-01), Buechler
patent: 5962081 (1999-10-01), Ohman
patent: 5995209 (1999-11-01), Ohman
patent: 6126765 (2000-10-01), Ohman
patent: 6144447 (2000-11-01), Ohman
patent: 6176962 (2001-01-01), Soane et al.
patent: 6192768 (2001-02-01), Wallman
patent: 6203291 (2001-03-01), Stemme
patent: 6322682 (2001-11-01), Arvidsson
patent: 6375871 (2002-04-01), Bentsen et al.
patent: 6454970 (2002-09-01), Ohman
patent: 6620478 (2003-09-01), Ohman
patent: 6632656 (2003-10-01), Thomas et al.
patent: 6653625 (2003-11-01), Andersson
patent: 6717136 (2004-04-01), Andersson
patent: 6728644 (2004-04-01), Bielik
patent: 6811736 (2004-11-01), Ohman
patent: 6812456 (2004-11-01), Andersson
patent: 6812457 (2004-11-01), Andersson
patent: 6855329 (2005-02-01), Shakesheff et al.
patent: 2003/0044322 (2003-03-01), Andersson
patent: 2003/0047823 (2003-03-01), Ohman
patent: 2003/0053934 (2003-03-01), Andersson
patent: 2003/0054563 (2003-03-01), Ljungstrom
patent: 2003/0082075 (2003-05-01), Agren
patent: 2003/0094502 (2003-05-01), Andersson
patent: 2003/0129360 (2003-07-01), Derand
patent: 2003/0156763 (2003-08-01), Soderman
patent: 2003/0211012 (2003-11-01), Bergstrom
patent: 2003/0213551 (2003-11-01), Derand
patent: 2003/0231312 (2003-12-01), Sjoberg
patent: 2004/0058408 (2004-03-01), Thomas
patent: 2004/0096867 (2004-05-01), Andersson
patent: 2004/0099310 (2004-05-01), Andersson
patent: 2004/0120856 (2004-06-01), Andersson
patent: 2004/0202579 (2004-10-01), Larsson et al.
patent: WO 91/16966 (1991-11-01), None
patent: WO 94/29400 (1994-12-01), None
patent: WO 98/45693 (1998-10-01), None
patent: WO 99/56954 (1999-11-01), None
patent: WO 99/58245 (1999-11-01), None
McCormick et al. Microchannel Electrophoretic Separations of DNA in Injection-Molded Plastic Substrates; Anal Chem, 1997, 69, 2626-2630.
U.S. Appl. No. 09/937,533, Larsson et al.
U.S. Appl. No. 10/169,056, Andersson et al.
U.S. Appl. No. 10/276,282, Larsson et al.
U.S. Appl. No. 10/402,138, Kylberg et al.
U.S. Appl. No. 09/958,577, Ulfendahl.
U.S. Appl. No. 09/869,554, Orlefors et al.
U.S. Appl. No. 09/830,475, Stjernstrom.
U.S. Appl. No. 10/168,942, Tooke et al.
U.S. Appl. No. 10/957,452, Ekstrand et al.
U.S. Appl. No. 10/070,912, Ohman et al.
U.S. Appl. No. 10/402,137, Kylberg et al.
U.S. Appl. No. 10/030,297, Derand et al.
U.S. Appl. No. 10/924,151, Tooke et al.
U.S. Appl. NO. 10/513,084, Holmquest et al.
U.S. Appl. No. 09/937,533, Derand et al.
U.S. Appl. No. 10/999,532, Ostlin et al.
U.S. Appl. NO. 10/867,893, Derand et al.
U.S. Appl. No. 11/017,252, Derand et al.
U.S. Appl. No. 10/450,177, Ohman et al.
U.S. Appl. No. 10/129,032, Tormod.
U.S. Appl. No. 09/674,457, Larsson et al.
U.S. Appl. No. 10/069,827, Derand et al.
U.S. Appl. No. 10/244,667, Agren.
U.S. Appl. No. 10/849,321, Fielden et al.
U.S. Appl. No. 10/111,822, Tooke et al.

Affiliated with

Also associated with

Rating

Method for covering a microfluidic assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for covering a microfluidic assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for covering a microfluidic assembly will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4138046