Method for coupling surface mounted capacitors to semiconductor

Details Method for coupling surface mounted capacitors to semiconductor Method for coupling surface mounted capacitors to semiconductor

1997-10-24

1998-12-01

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

228219, 2282481, B23K 1008

Patent

active

058426264

ABSTRACT:
A low cost method for mechanically and electrically coupling a surface mounted capacitor to a semiconductor package. In one embodiment a metal coating is deposited over the electrodes of a capacitor. Concurrently, or at some other time, solder paste is applied to the electrical contact pads of a semiconductor package. The connection between the capacitor and package is made by positioning the metal coated regions of the capacitor over the electrical contact pads of the package and running the unit through a reflow furnace where the solder paste is wetted onto the metal coating of the capacitor and onto the electrical contact pads of the package.

REFERENCES:
patent: 3609471 (1971-09-01), Scace
patent: 4113578 (1978-09-01), Del Monte
patent: 4784310 (1988-11-01), Metzger et al.
patent: 5055914 (1991-10-01), Shimizu et al.
patent: 5564617 (1996-10-01), Degani et al.

Affiliated with

Also associated with

Rating

Method for coupling surface mounted capacitors to semiconductor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for coupling surface mounted capacitors to semiconductor , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for coupling surface mounted capacitors to semiconductor will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2390082