Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1998-01-20
1999-12-21
Yao, Sam Chuan
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156294, 156295, 156305, 1563086, B29C 6554
Patent
active
060044179
ABSTRACT:
A microencapsulatable solvent adhesive composition for coupling plastic conduits, such as pipes, connectors and related fittings comprises a water-insoluble polymer and a mixture of volatile organic solvents for the polymer, each of the solvents having 6 to 40 carbon atoms. This solvent adhesive composition is suitable for microencapsulation by aqueous-based microencapsulation processes. A plurality of microcapsules encapsulating the solvent adhesive composition are bound to a polymeric surface of a conduit, such as a pipe connector or fitting, by a binder composition, to form a surface coated with a layer of rupturable microcapsules. When the microcapsules are ruptured upon joining of the coated conduit to a second conduit, the volume of the released solvent adhesive composition is sufficient to cement the surfaces together.
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Hillenbrand Gary F.
Lynch Roland M.
Maccarone David A.
Newsom Morris F.
Roesch Mark A.
The Lamson & Sessions Co.
Yao Sam Chuan
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