Method for coupling a power lead to a bond pad in an electronic

Details Method for coupling a power lead to a bond pad in an electronic Method for coupling a power lead to a bond pad in an electronic

1994-05-24

1996-08-13

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

29843, 29880, 22818021, 361767, H05K 330

Patent

active

055444121

ABSTRACT:
An electronic module and a method for coupling a power lead (32) to a bond pad (28) on a semiconductor die (17) within the electronic module. A clip support (13) having a slot (27) is coupled to a baseplate (11) via an isolation structure (14). The semiconductor die (17) is coupled to the baseplate (11) via an isolation structure (19). The power lead (32) is coupled to the isolation structure (14). The clip support (13) is coupled to the semiconductor die (17) via a clip (29), wherein a first end of the clip (29) is inserted in the slot (27) and a second end of the clip (29) is compressively mated with the semiconductor die (17). Compressively mating the clip (29) with the semiconductor die (17) eliminates the need for bond feet, thereby increasing the reliability of the module.

REFERENCES:
patent: 3855693 (1974-12-01), Umbaugh
patent: 4629278 (1986-12-01), Norton et al.
patent: 4675989 (1987-06-01), Galloway et al.
patent: 5272596 (1993-12-01), Honore et al.
patent: 5363552 (1994-11-01), Coniff
patent: 5398863 (1995-03-01), Grube et al.

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