Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1986-05-20
1987-03-31
Czaja, Donald
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156 94, 1562722, 1562737, 1562739, 1562757, 156299, 156521, 2940209, 29829, 29843, 29850, 29874, 228179, B32B 3116
Patent
active
046541020
ABSTRACT:
A method and apparatus are shown for use in adding electrical connections to existing printed circuit boards. To this end, apparatus in the form of a multilayered pad is provided which has an adhesive layer over at least part of one face which is responsive to heat so that the pad can be bonded by heat to the surface of a printed circuit board. The other face of the pad includes a layer of stainless steel to which nickel wire can be stitched, or welded. A method according to the invention includes cutting a sheet of pads into individual pads, placing a plurality of pads, adhesive side down, on the surface of a printed circuit board, heating the pads to bond them to the board, and stitching (welding) wire to a succession of pads to complete a series of new connections. Some pads include plated-through-holes enabling connections to be completed from the pads to existing circuitry on the boards and to components mounted in the holes by the use of flow soldering techniques.
REFERENCES:
patent: 3114194 (1963-12-01), Lohs
patent: 3462540 (1969-08-01), Harris
patent: 3536565 (1970-10-01), Dedek
patent: 3680209 (1972-08-01), Hacke
patent: 3786172 (1974-01-01), Conley
patent: 3795047 (1974-03-01), Abolafia et al.
patent: 3827918 (1974-08-01), Ameen
patent: 3850711 (1974-11-01), Conley
patent: 3969815 (1976-07-01), Hackey et al.
patent: 4104109 (1978-08-01), Grau et al.
patent: 4157932 (1979-06-01), Hirata
patent: 4445952 (1984-05-01), Reynolds
Jehay Michel
Job Andre
Wery Jean C.
Burroughs Corporation
Cashion Jr. Merrell C.
Czaja Donald
Peterson Kevin R.
Young Mervyn L.
LandOfFree
Method for correcting printed circuit boards does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for correcting printed circuit boards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for correcting printed circuit boards will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2211348