Method for coplanarity inspection of package or substrate warpag

Optics: measuring and testing – By polarized light examination – With light attenuation

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356237, G01B 1100

Patent

active

054651522

ABSTRACT:
A method for determining coplanarity with 3-D sensing means of substrates for ball grid array, column grid array, and similar surface mount integrated circuit chips, in which opaque fiducials are provided as index pads. Heights of the index pads are correlated with signal pad heights in a neighborhood about the index pads. The index pads are opaque to incident radiation from the 3-D sensor. The index pads reflect sufficient radiation to be detected easily by the 3-D sensor. The index pads are disposed in a prearranged pattern over a domain of ball grid array signal pads. The index pads are restricted to a predetermined range of heights.

REFERENCES:
Cammarano et al "Optical Testing of Solder Pads" IBM Technical Disclosure Bulletin, vol. 21, No. 7, Dec. 1978, pp. 2914-29-15.

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