Method for cooling of chips using blind holes with customized de

Metal working – Method of mechanical manufacture – Electrical device making

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29832, 257704, 257705, 257717, 257718, 165 802, 165 803, H05K 334

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active

058194029

ABSTRACT:
The present invention relates generally to a new apparatus and method for customized cooling of chips. More particularly, the invention encompasses an apparatus and a method that provides customized cooling of a MCM (Multi-Chip Module) by varying the depth of thermal compound filled gap or the blind hole that is above each chip.

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